Item
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Notes
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Network Hub
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Set in control room to take output from experimental room ethernet connection. Control laptops connected via 5GHz WiFi.
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Control Laptop x2
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1 for remote control of FPGA, 1 for notes/web GUI.
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Ethernet Cable x 2
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To connect DAQ laptop to network in the experimental room, control laptop to network in control room.
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Portable Enclosure
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Modified Large Peli Case Waterproof Wheeled Equipment Case. Features mount for scintillator stacks, front and back openings for beam, patch panel with ports for USB and power connections. Mylar windows with 3D printed alignment plates: approximately light-tight.
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Rev. D Scintillator stack 1
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32 X x 105 mm, Y x 105 mm and Z x (approx) 3 mm sheets. Original injection moulded batch with polished edges and sanded faces. Containing sheets (ascending photodiode order, board upside down): 137, 138, 139, 140, 141, 142, 143, 144, 145, 146, 147, 148, 149, 150, 151, 152, 153, 154, 155, 156, 157, 158, 159, 160, 161, 162, 163, 164, 165, 166, 167, 168. Full stack thickness measurements (in mm): 95.75, 96.02, 96.09 = 95.95
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Rev. D Scintillator stack 2
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32 X x 105 mm, Y x 105 mm and Z x (approx) 3 mm sheets. Machined block with polished edges and sanded faces. Containing sheets (ascending photodiode order, board upside down): 289, 268, 291, 277, 300, 264, 282, 276, 271, 285, 262, 280, 295, 281, 297, 290, 270, 284, 294, 299, 269, 302, 301, 296, 287, 263, 288, 293, 285, 265, 275, 292. Full stack thickness measurements (in mm): 96.89, 96.85, 96.70 = 96.81
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Rev. D Scintillator stack 3
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32 X x 105 mm, Y x 105 mm and Z x (approx) 3 mm sheets. Injection moulded with polished edges and sanded faces. Containing sheets (ascending photodiode order, board upside down): 232, 208, 242, 206, 243, 223, 254, 210, 229, 217, 235, 255, 246, 230, 213, 241, 231, 257, 256, 236, 258, 215, 219, 249, 247, 260, 251, 259, 226, 239, 237, 245 Full stack thickness measurements (in mm): 95.57, 95.42, 95.46 = 95.48
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Rev. D Scintillator stack 4
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32 X x 105 mm, Y x 105 mm and Z x (approx) 3 mm sheets. Mix of injection moulded and machined block with polished edges and sanded faces. Containing sheets (ascending photodiode order, board upside down): 228, 220, 225, 227, 218, 214, 238, 248, 209, 253, 224, 222, 211, 261, 250, 234, 212, 233, 252, 240, 221, 207, 244, 283, 272, 279, 298, 274, 273, 267, 278, 266. Full stack thickness measurements (in mm): 94.12, 94.01, 94.09 = 94.07
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DAQ laptop x1
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Control photodiode acquisition.
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Nexys Video FPGA development board.
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For interfacing between DDC232 and PC.
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Rev. D Texas Instruments DDC232 custom circuit board (x4)
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Housing 32x Hamamatsu S12915-16R photodiodes, coupled directly to scintillator sheets. Aligned by eye to scintillator sheets.
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Gloves
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For handling scintillator
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